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International Program Committee

• N. Aikawa – Nihon University, Japan
• H. Al-Asaad – University of California, Davis, USA
• P.K. Ampadu – University of Rochester, USA
• S. Areibi – University of Guelph, Canada
• A. Azemi – Penn State University, USA
• J. Bian – Tsinghua University, PR China
• M. Biey – Turin Polytechnic, Italy
• E. Bruun – Technical University of Denmark, Denmark
• C.I. Byrnes – Washington University in St. Louis
• A. Demosthenous – University College London, UK
• J. Di – University of Arkansas, USA
• J. Dobes – Czech Technical University in Prague, Czech Republic
• M. Fardmanesh – Sharif University of Technology, Iran
• A. Ioinovici – Holon Institute of Technology, Israel
• M.T. Johnson – Marquette University, USA
• V.M. Joyner – Tufts University, USA
• S. Jung – University of Texas at Arlington, USA
• K.U. Kirstein – Miromico AG, Switzerland
• H.L. Kwok – University of Victoria, Canada
• I. Lemberski – Baltic International Academy, Latvia
• K.L. Man – University College Cork, Ireland
• P. Mohseni – Case Western Reserve University, USA
• J.K. Muppala – Hong Kong University of Science and Technology, PR China
• R.W. Newcomb – University of Maryland, College Park, USA
• O. Palusinski – University of Arizona, USA
• B. Psenicka – National Autonomous University of Mexico, Mexico
• S.C. Schneider – Marquette University, USA
• G. Setti – University of Ferrara, Italy
• J. Smith – University of Georgia, USA
• H. Sotobayashi – National Institute of Information and Communication Technology, Japan
• R. Sridhar – State University of New York at Buffalo, USA
• A. Srivastava – Louisiana State University, USA
• Z. Stamenkovic – Innovations for High Performance Microelectronics, Germany
• A.A. Stocker – New York University, USA
• J. Sun – Rensselaer Polytechnic Institute, USA
• Y. Sun – University of Hertfordshire, UK
• D.V. Tosic – University of Belgrade, Serbia
• I. Valova – University of Massachusetts Dartmouth, USA
• G. Vannini – University of Ferrara, Italy
• L. Wang – University of Connecticut, USA
• A. Worapishet – Mahankorn University of Technology, Thailand
• X.-G. Xia – University of Delaware, USA
• H. Xie – University of Florida, USA
• Y. Yaz – Milwaukee School of Engineering, USA
• M.E. Zaghloul – George Washington University, USA
• C.N. Zhang – University of Regina, Canada